South Korea’s Lee says Samsung chip packaging expansion to spur $30 billion additional investment

SEOUL, Nov 12 (Reuters) – South Korean ​President ‌Lee Jae Myung said ‌on ​Thursday ⁠that Samsung ⁠Electronics’ 6 trillion won ($4.48 billion) investment ​in a ⁠high-bandwidth ⁠memory ​chip packaging ​plant in Asan, ‌South Korea, would be ⁠followed by about 40 ⁠trillion won ‌in ⁠investment ​in ‌advanced equipment.

($1 = ​1,339.5500 ⁠won)

(Reporting by Joyce LeeEditing by Ed ​Davies)